data sheet doc. no : qw0905- rev. : date : a 22 - jun. - 2006 LUG2643-1-PF super bright round type led lamps LUG2643-1-PF pb lead-free parts ligitek electronics co.,ltd. property of ligitek only
25.0min 1.0min directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 2.54typ package dimensions LUG2643-1-PF part no. 4.3 3.3 0.5 typ 1.5max 3.1 2.9 ligitek electronics co.,ltd. property of ligitek only page 1/5 + -
* static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. v 2000 esd electrostatic discharge( * ) emitted green note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) absolute maximum ratings at ta=25 reverse current @5v LUG2643-1-PF part no algainp material storage temperature operating temperature power dissipation peak forward current duty 1/10@10khz forward current parameter a 10 ir forward voltage @ ma(v) spectral halfwidth nm dominant wave length dnm luminous intensity @20ma(mcd) viewing angle 2 1/2 (deg) min. 120 lens water clear 574 color min.max. 1.7 202.6 20 typ. 40 220 tstg t opr -40 ~ +100 -40 ~ +85 pd i fp 100 120 i f symbol ug 30 ratings mw ma ma unit ligitek electronics co.,ltd. property of ligitek only page 2/5 part no. LUG2643-1-PF
3.0 2.5 1.5 1.0 0.5 0.0 2.0 fig.4 relative intensity vs. temperature r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 500 0.0 0.5 550600650 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -40 0.8 -20 1.1 1.0 0.9 1.2 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 20 060 40100 80 100 20 ambient temperature( ) -20 -40 060 4080 typical electro-optical characteristics curve 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage forward voltage(v) 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 1.0 10 ug chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 2.03.0 1000 forward current(ma) 1.010100 4.05.0 page3/5 part no. LUG2643-1-PF
page 4/5 ligitek electronics co.,ltd. property of ligitek only dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 2.wave soldering profile 150 260 c3sec max 5 /sec max 260 120 100 2 /sec max 50 25 0 0 preheat 60 seconds max time(sec) temp( c) part no. LUG2643-1-PF
page 5/5 ligitek electronics co.,ltd. property of ligitek only mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard description this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-883:1008 jis c 7021: b-10 mil-std-202:103b jis c 7021: b-11 jis c 7021: b-12 the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. test item operating life test reliability test: high temperature storage test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test low temperature storage test thermal shock test solder resistance test solderability test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) test condition part no. LUG2643-1-PF
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